Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59effa3548646c62500204cc15418e67 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76859 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c0a65dd3aa7ddb2d11ffd6831fe097 |
publicationDate |
2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2007145598-A1 |
titleOfInvention |
Method of forming a metal interconnection in a semiconductor device |
abstract |
A method includes at least one of: forming a metal interconnection in a semiconductor device; forming an inter-metal dielectric layer over a substrate and/or a lower metal layer; forming a photoresist pattern over an inter-metal dielectric layer; forming a via hole by selectively etching an inter-metal dielectric layer using a photoresist pattern as a mask; forming an ionization layer in a via plug by ion implantation on a sidewall of a via hole; forming a barrier metal layer and a via plug in the via hole; and/or forming a metal interconnection. In embodiments, a barrier metal layer may include titanium nitride and/or a via plug may include tungsten. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022189774-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008182409-A1 |
priorityDate |
2005-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |