http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007145598-A1

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_59effa3548646c62500204cc15418e67
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76859
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5226
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76825
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate 2006-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_93c0a65dd3aa7ddb2d11ffd6831fe097
publicationDate 2007-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2007145598-A1
titleOfInvention Method of forming a metal interconnection in a semiconductor device
abstract A method includes at least one of: forming a metal interconnection in a semiconductor device; forming an inter-metal dielectric layer over a substrate and/or a lower metal layer; forming a photoresist pattern over an inter-metal dielectric layer; forming a via hole by selectively etching an inter-metal dielectric layer using a photoresist pattern as a mask; forming an ionization layer in a via plug by ion implantation on a sidewall of a via hole; forming a barrier metal layer and a via plug in the via hole; and/or forming a metal interconnection. In embodiments, a barrier metal layer may include titanium nitride and/or a via plug may include tungsten.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2022189774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008182409-A1
priorityDate 2005-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6784095-B1
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559362
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23964
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID93091
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425762086

Total number of triples: 25.