Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd83260a96356882b5f50dd097411a72 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76829 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76832 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-4763 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 |
filingDate |
2006-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0cf8429af007246dc0798168a5d33e52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae321732587a9e5e7fae21601f68a1a3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bff9e4317279eb5d270e0aff201d8f30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3fe36206b80cd0765a0fbfe9bae719bd |
publicationDate |
2006-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-2006276029-A1 |
titleOfInvention |
Semiconductor device and method for manufacturing same |
abstract |
The present invention reduces the effective dielectric constant of the interlayer insulating film while inhibiting the decrease of the reliability of the semiconductor device, which otherwise is caused by a moisture absorption. A copper interconnect comprising a Cu film 209 is formed in multilayer films comprising a L-Ox™ film 203 and a SiO 2 film 204. Since the L-Ox™ film 203 comprises ladder-shaped siloxane hydride structure, the film thickness and the film characteristics are stable, and thus changes in the film quality is scarcely occurred during the manufacturing process. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8575019-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7781335-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007262370-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012080792-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009081865-A1 |
priorityDate |
2003-01-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |