http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006125020-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14643
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-146
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-10
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-14689
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-94
filingDate 2005-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_182d1850ee310ac20cc29fe855de71ff
publicationDate 2006-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2006125020-A1
titleOfInvention CMOS image sensor and method for fabricating the same
abstract A CMOS image sensor and a method for fabricating the same are disclosed, in which an incidence of void formation is reduced or prevented, to improve characteristics of the image sensor. The CMOS image sensor includes a plurality of photodiode areas in a semiconductor substrate at constant intervals, a dielectric layer on or over the semiconductor substrate and the photodiode areas, a color filter layer on or over the dielectric layer at constant intervals, a void prevention layer between adjacent color filters in the color filter layer, a planarization layer on or over the semiconductor substrate and the void prevention layer, and a plurality of microlenses on the planarization layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006138485-A1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8395699-B2
priorityDate 2004-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.