| abstract |
In an embodiment, a method of forming a capacitor for a semiconductor device of which structural stability is improved is shown. Cylindrical storage electrodes are formed in a matrix pattern on a substrate that includes an insulation interlayer having contacts therein so that a mold layer surrounds the cylindrical storage electrodes. Sacrificial plugs are formed with a cap within these electrodes. A stabilizing layer is formed on the etched mold layer and the cylindrical storage electrode by partially etching the mold layer. The stabilizing layer is etched until the sacrificial plug is exposed, thereby forming a spacer. While the sacrificial plug and the mold layer are fully removed, the spacer is partially removed, thereby forming a stabilizing member for supporting neighboring storage electrodes adjacent to each other. Accordingly, a structural stability of the capacitor is improved. |