| abstract |
An apparatus for removing an immersion lithography liquid and a method of immersion lithography are disclosed, that rapidly and easily remove liquid from a wafer before development and after exposure. The apparatus includes a housing device configured to prevent the exposure chamber from being contaminated with a scattered liquid; a (rotatable) stage inside the housing device, configured to support a substrate; and (i) a motor configured to rotate the stage or (ii) a gas-spraying device or nozzle above the stage, configured to spray the substrate with an inert gas. The method generally includes coating a photoresist on a substrate; immersing the substrate in a liquid; exposing the substrate; removing the liquid from the substrate by (i) rotating the stage and/or substrate or (ii) spraying the substrate with an inert gas; and developing the photoresist. |