| abstract |
A method for forming solder bumps on a flip-chip semiconductor die using a wirebonder apparatus and a flip-chip die bumped according to the method disclosed. An embodiment of the invention includes feeding a solder wire through a wirebonder capillary, where the solder wire forms a solder sphere upon exiting the wirebonder capillary. The solder sphere may then be attached to a solder pad on a flip-chip die, compressing the solder sphere into a solder stud bond. The solder stud bond may then be severed from the solder wire and reflowed into a more spherical solder bump in an oven-reflow process. |