| abstract |
A method for creating an under bump metallization layer ( 37 ) is provided. In accordance with the method, a die ( 33 ) is provided which has a die pad ( 35 ) disposed thereon. A photo-definable polymer ( 51 or 71 ) is deposited on the die pad, and an aperture ( 66 ) is created in the photo-definable polymer. Finally, an under bump metallization layer ( 37 ) is deposited in the aperture. A die package is also provided comprising a die having a die pad ( 35 ) disposed thereon, and having an under bump metallization layer ( 37 ) disposed on the die pad. The structure has a depression or receptacle ( 57 ) therein and has a thickness of at least about 20 microns. |