| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4fab697d131310a1215a2acb8ef8f036 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76895 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F17-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-822
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 |
| filingDate |
2002-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_debe91d8e0db786d19f40216a837edef
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67a6a1b899b54865285300e364f509ac |
| publicationDate |
2003-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-2003109133-A1 |
| titleOfInvention |
Process for fabricating an electronic component incorporating an inductive microcomponent |
| abstract |
The invention relates to a process for fabricating electronic components, incorporating an inductive microcomponent placed on top of a substrate. n Such a component comprises: n at least one superposition of a layer ( 10, 10 a ) of material having a low relative permittivity and of a hard mask layer, the first layer ( 10 ) of material having a low relative permittivity resting on the upper face of the substrate ( 1 ); n a number of defined metal turns ( 39 ) on top of the superposition of layers ( 10, 10 a ) of material having a low relative permittivity; and n a copper diffusion barrier layer ( 35 ) present on the lower and lateral faces of the metal turns ( 39 ). |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007196066-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006024953-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10079177-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2007040473-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2290816-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009079078-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7727410-B2 |
| priorityDate |
2001-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |