http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003082906-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76885
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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522
filingDate 2001-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5446de3bbf42b56147cba26c946675c
publicationDate 2003-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2003082906-A1
titleOfInvention Via formation in polymers
abstract A method for forming relatively small vias in polymers which may have an underlying layer is disclosed. In a first embodiment, plated pillars are formed on a plated bottom metal layer. A polymer is coated over the first metal layer and the plated pillars and cured. The polymer is blanket etched to expose the top surface of the plated pillars. A metal layer is formed on top of the polymer layer and exposed surfaces of the plated pillars. In a second embodiment of the invention, pillars made from a photoresist are formed over a bottom metal layer. A polymer layer is coated over the pillars and the bottom metal layer and blanket etched to the surface of the photoresist pillar. The photoresist pillars are then removed forming vias. A top metal layer is formed on top of the polymer coating in the vias to connect to the bottom metal layer.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008105647-A1
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priorityDate 2001-10-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 41.