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filingDate 2001-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ab0f8c9539365273fb2327c2f23943e7
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publicationDate 2001-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-2001055839-A1
titleOfInvention Method of fabricating a dielectric antifuse structure
abstract A dielectric antifuse structure is fabricated in an integrated circuit. The antifuse structure is incorporated in a contact hole in an oxide layer and has a dielectric layer arranged between a first conductive layer and a second conductive layer.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004227260-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006281210-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6774439-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7615813-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2019177930-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008012057-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I717685-B
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 25.