Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823487 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823481 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7827 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0653 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66666 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-1037 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-088 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 |
filingDate |
2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2022-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5a82d7a728afaa89155a2c36ec245cc2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9826333fc9aa5a6a598b1acd180fd3d0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d05f1f86d9fa7250567755f12c7d0d53 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fa57155a94ec485068066724e7721ca7 |
publicationDate |
2022-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-11271107-B2 |
titleOfInvention |
Reduction of bottom epitaxy parasitics for vertical transport field effect transistors |
abstract |
A semiconductor device structure comprises at least one semiconductor fin for a vertical transport field effect transistor, a bottom source/drain layer, and an insulating layer underlying the bottom source/drain layer. A method of forming the structure comprises forming a sacrificial layer within a lower portion of a source/drain region for a vertical transport field effect transistor structure. The sacrificial layer being formed adjacent to at least one semiconductor fin and in contact with a substrate. A source/drain layer is formed within an upper portion of the source/drain region above the sacrificial layer. The sacrificial layer is removed thereby forming a cavity between the substrate and the source/drain layer. An insulating layer is formed within the cavity. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11749678-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11404412-B2 |
priorityDate |
2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |