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filingDate 2020-05-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2021-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-11152249-B2
titleOfInvention Methods of forming FinFET devices
abstract A method of forming a FinFET device includes following steps. A substrate is provided with a plurality of fins thereon, an isolation layer thereon covering lower portions of the fins, a plurality of dummy strips across the fins, and a dielectric layer aside the dummy strips. The dummy strips is cut to form a trench in the dielectric layer. A first insulating structure is formed in the trench, wherein first and second groups of the dummy strips are beside the first insulating structure. A dummy strip is removed from the first group of the dummy strips to form a first opening that exposes portions of the fins under the dummy strip. The portions of the fins are removed to form a plurality of second openings below the first opening, wherein each second opening has a middle-wide profile. A second insulating structure is formed in the first and second openings.
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