| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98a75c9fff239084cf3c988c59841957 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0273
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02164
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-423
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-43
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D3-2044 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C11D7-34 |
| filingDate |
2019-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84cfc15b8d9198d7561c9796a7dd756a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a45c6cfdaf88cc5ff7d6727a0c53473d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a53fa6bf70f6b51bf4e2f7e5ff6c138d |
| publicationDate |
2021-07-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-11054749-B2 |
| titleOfInvention |
Photoresist stripping composition and method |
| abstract |
An organic photoresist stripping composition and method of using the composition with silicon wafers having an insulating layer and metallization on the wafers, having an aryl sulfonic acid or alkylaryl sulfonic acid or mixtures thereof; 1,3-dihydroxybenzene (resorcinol) or sorbitol or mixtures thereof; one or more hydrocarbon solvents having a flash point of greater than about 65° C., and optionally less than about 0.5% by weight water based on the total weight of the composition. The composition may also be used for the removal of other materials from other substrates. |
| priorityDate |
2018-05-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |