| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fd446fb0d73aa96d044fea2eaa3c8ebc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0112
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2201-0132
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0264
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2203-0127 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-0076
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-00325
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-0061
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L9-0042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01L19-146 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81B7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L19-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L19-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01L9-00 |
| filingDate |
2017-09-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_497d22d732489344265942eef80aa233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_68607dc4270eee3f60799dd9002f9c49
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23dd8df8c5546f1d930759566310eead
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_031f29e4089c4834e894580c379c65a1 |
| publicationDate |
2021-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10988377-B2 |
| titleOfInvention |
Method for producing a stress-decoupled micromechanical pressure sensor |
| abstract |
A method for producing a micromechanical pressure sensor. The method includes: providing a MEMS wafer having a silicon substrate and a first cavity developed therein underneath a sensor diaphragm; providing a second wafer; bonding the MEMS wafer to the second wafer; and exposing a sensor core from the rear side; a second cavity being formed in the process between the sensor core and the surface of the silicon substrate, and the second cavity being developed with the aid of an etching process which is carried out using etching parameters that are modified in a defined manner. |
| priorityDate |
2016-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |