Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_49eda4cffb9f8e06e322adaa742c393b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-005 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-502 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-24 |
filingDate |
2016-06-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aff6b8da253dbb2b27df4c7d67fdfbf4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0d383766692d220e9697b5f363aa7020 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd3bbc84fc32ff001bb7cce18d8c32e0 |
publicationDate |
2021-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10892385-B2 |
titleOfInvention |
LED fabrication using high-refractive-index adhesives |
abstract |
Silicone-containing adhesive layer formed by cyclic ring-opening polymerization and comprising amounts of an organic base and bonding a wavelength converting layer to a thickness of sapphire in a light-emitting diode (LED) apparatus. Methods enabling its uninhibited curing so as to achieve contaminant-free and debris-free adhesion between surfaces. LED apparatus designed and manufactured such that surfaces to be bonded together are prepared in a manner that facilitates use of high-refractive-index adhesives. A multi-step process involving two different concentrations of a catalyst is performed so as to fabricate highly-reliable, non-browning, and non-cracking high-refractive-index adhesives for light-emitting diode component fabrication. |
priorityDate |
2015-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |