Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b2d32a1324eb3a240649ffee8d475d63 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-0665 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66477 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-056 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-42372 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-4238 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-10826 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66795 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-66818 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L29-7853 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-66 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-423 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-762 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-06 |
filingDate |
2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2020-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3480968d99b19bfa066eeb3143e9845d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e96fade086cf4dac6633361d7ebb9dcf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0877afb27fa7f24427cd1099a0ef61b |
publicationDate |
2020-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-10825931-B2 |
titleOfInvention |
Semiconductor device with undercutted-gate and method of fabricating the same |
abstract |
A semiconductor device includes a semiconductor substrate, a dielectric layer, a gate structure, a source semiconductor feature, and a drain semiconductor feature. The semiconductor substrate has an active area and a shallow trench isolation (STI) structure surrounding the active area. The semiconductor substrate includes a protrusion structure in the active area and has an undercut at a periphery of the active area. The dielectric layer overlays the protrusion structure of the semiconductor substrate and fills at least a portion of the undercut of the protrusion structure. The gate structure crosses over the protrusion structure. The source semiconductor feature and the drain semiconductor feature are located in the active area and positioned at opposite sides of the gate structure. |
priorityDate |
2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |