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filingDate 2018-02-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3480968d99b19bfa066eeb3143e9845d
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publicationDate 2020-11-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10825931-B2
titleOfInvention Semiconductor device with undercutted-gate and method of fabricating the same
abstract A semiconductor device includes a semiconductor substrate, a dielectric layer, a gate structure, a source semiconductor feature, and a drain semiconductor feature. The semiconductor substrate has an active area and a shallow trench isolation (STI) structure surrounding the active area. The semiconductor substrate includes a protrusion structure in the active area and has an undercut at a periphery of the active area. The dielectric layer overlays the protrusion structure of the semiconductor substrate and fills at least a portion of the undercut of the protrusion structure. The gate structure crosses over the protrusion structure. The source semiconductor feature and the drain semiconductor feature are located in the active area and positioned at opposite sides of the gate structure.
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