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filingDate 2016-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2019-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10472478-B2
titleOfInvention Prepreg, metal-clad laminate and printed wiring board
abstract A prepreg includes: a woven fabric base; and a semi-cured product of a resin composition, which fills an inside of the woven fabric base and coats a surface of the woven fabric base. The resin composition includes a thermosetting resin, an inorganic filler, a first thermoplastic resin soluble in an organic solvent, and a second thermoplastic resin insoluble in an organic solvent. With respect to 100 parts by mass of the thermosetting resin, a content ratio of the inorganic filler ranges from 50 parts by mass to 150 parts by mass, inclusive, and a total content ratio of the first thermoplastic resin and the second thermoplastic resin ranges from 20 parts by mass to 50 parts by mass, inclusive.
priorityDate 2015-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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