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filingDate 2018-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5ae1321030ea7c8fb285421ec35b82c
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publicationDate 2019-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10283624-B1
titleOfInvention Semiconductor structure and method for forming the same
abstract A semiconductor device and a method for forming the same are provided. The method includes forming a gate structure over a fin structure. The method further includes forming first gate spacers on opposite sidewalls of the gate structure. The method further includes forming source/drain features in the fin structure and adjacent to the first gate spacers. The method further includes performing a surface treatment process on top surfaces of the source/drain features and outer sidewalls of the first gate spacers. The method further includes depositing a contact etch stop layer (CESL) over the source/drain features and the first gate spacers. A first portion of the CESL is deposited over the top surfaces of the source/drain features at a first deposition rate. A second portion of the CESL is deposited over the outer sidewalls of the first gate spacers at a second deposition rate.
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