| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e443fcd44793752f156437bbfd4c8603 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5403
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5419 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5419
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-37
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-13
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-32 |
| filingDate |
2014-05-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2eed6491c2bd1410f1b0483e11670ef9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bb10561d23676df0f16eb20654cf1c61
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8d49d097a9f8b48938c3f384e814cfde |
| publicationDate |
2019-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-10208206-B2 |
| titleOfInvention |
Curable resin composition and cured product thereof, sealing material for optical semiconductor, die bonding material, and optical semiconductor light-emitting element |
| abstract |
The present invention relates to a curable resin composition comprising (A) an epoxy compound having three or more epoxy groups in one molecule and (B) an active hydrogen compound. |
| priorityDate |
2013-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |