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filingDate 2008-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f7dcbc887d55149fc51d579ecbab676
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publicationDate 2010-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2010053203-A
titleOfInvention Thermosetting resin composition
abstract Provided is a thermosetting resin composition that can be used for sealing a light-emitting element having a high output in a short wavelength region, has a good surface non-tack property of a cured product, is transparent, and has excellent light resistance and heat yellowing resistance. To do. A thermosetting resin composition contains the following component (A) and component (B), and the ratio of the content of both components is based on mass: component (A): component (B) = 20: 80 to 80:20. Component (A): A carboxyl group-containing polysiloxane having a specific structure having a plurality of carboxyl groups and having a siloxane bond. Component (B): an alicyclic epoxy group-containing cage-type silsesquioxane having a specific structure having a plurality of alicyclic epoxy groups and having a cyclohexane ring and a siloxane bond. [Selection figure] None
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