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publicationDate 2018-07-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-10014179-B2
titleOfInvention Methods for forming cobalt-copper selective fill for an interconnect
abstract Methods for processing a substrate include: (a) depositing a cobalt layer to a first thickness within a first plurality of features and a second plurality of features formed in a substrate, wherein each of the first plurality of features and each of the second plurality of features comprises an opening, and wherein a width of the openings of the first plurality of features is less than a width of the openings of the second plurality of features; and (b) heating the substrate to a first temperature to fill the first plurality of features with cobalt material while simultaneously depositing a fill material on the substrate to fill the second plurality of features.
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