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filingDate 2015-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c96cfb101adb450c7f55b8099310c021
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publicationDate 2021-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I733431-B
titleOfInvention Chemistries for tsv/mems/power device etching
abstract Replacement chemistries for the cC 4 nF 8 npassivation gas in the Bosch etch process and processes for using the same are disclosed. These chemistries have the formula C x nH y nF z n, with 1≤x＜7, 1≤y≤13, and 1≤z≤13. The replacement chemistries may reduce RIE lag associated with deep silicon aperture etching.
priorityDate 2014-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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