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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_028b4433718d1c61a4bbc36a114b502f
publicationDate 2021-04-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I725072-B
titleOfInvention Etching method
abstract The purpose of the present invention is to increase the mask selection ratio. The present invention provides an etching method, which is a method of etching an insulating layer on a to-be-processed body in a processing container provided with upper and lower electrodes opposed to each other, and includes the following steps: The process gas of fluorocarbon gas and silicon tetrafluoride (SiF 4 ) gas applies high-frequency power to at least any one of the upper electrode and the lower electrode to generate plasma, and the generated plasma mediates The insulating layer is etched through the mask.
priorityDate 2015-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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