abstract |
The invention relates to a method for manufacturing a substrate arrangement (10; 10'; 10") for connection to an electronic component (30; 30') comprising the steps: - providing a substrate (11) having a first side (12) and a second side (13), - applying a contacting material later (15) to the first side (12) of the substrate (11), - applying prefixation means (18) to a side (16) of the contacting material layer (15) facing away from the substrate (11) in at least some sections. |