| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8e0bf0928b608797b70bbc2b91c7e52e |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-461
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 |
| filingDate |
2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f3c18d7da651a59371c53cae49897330
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_17fdd1fe67be62d7acc0db72020fddb7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a1414fec48a04cca431d1ff2b4b4524c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e5ad8cccd5c57dcd6928fd2f98e6e9bb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_00637f4cbedc142ca6b8e4795d8b360f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ee5b8569dd2e22438b2897404692b0c
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_97fc0f6e23222b8308cc9925c0c82cab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8c731dc1d3fb9618e5c80a21cdf73611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7f8dbb0bfd41a59323553a8c03bd7738
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6bc307fb60236904b732d210fba663dc |
| publicationDate |
2020-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I700358-B |
| titleOfInvention |
A chemical mechanical polishing (cmp) composition for high effective polishing of substrates comprising germanium |
| abstract |
A chemical mechanical polishing (CMP) composition (Q) comprising: n n (A) inorganic particles, n n (B) a compound of general formula (I)n n (C) an aqueous medium wherein the composition (Q) has a pH of from 2 to 6. |
| priorityDate |
2014-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |