| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8cf8d77ac0eff1767b22d2fb9445b64d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32633
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32009
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2014-04-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b8f12f8e3085bca61142e56986e9bf5d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_208fd14dacbaa5877fc94a08898e80b7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_473bd16f6996715687fefefd6fdd6ab3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b29e5429a4f08e4648420425dd9be9e7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7a02db22c3089c77bc2ed95a15d0bed8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4beb5ee0ed4fd17822a559ddd9c4536 |
| publicationDate |
2019-11-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I677025-B |
| titleOfInvention |
Internal plasma grid for semiconductor manufacturing |
| abstract |
The embodiments herein relate to a method and apparatus for etching a semiconductor substrate. A plasma grid assembly is placed in a reaction chamber to separate the reaction chamber into an upper subchamber and a lower subchamber. The plasma grid assembly may include one or more plasma grids. The grid has a slot with a specific aspect ratio to allow certain species to pass from the upper sub-chamber to the lower sub-chamber. When using multiple plasma grids, one or more of the grids are movable to maintain at least the plasma conditions in the lower sub-chamber. In some cases, an electron-ion plasma is generated in the upper sub-chamber. The electrons that reach the lower sub-chamber through the grille are cooled by passing through the grille. In some cases, this can lead to an ion-ion plasma in the lower sub-chamber. |
| priorityDate |
2013-04-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |