| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-334
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J2237-335 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67034
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32174
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02046 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate |
2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c58a196c0cee6cedabb8b80178e42080
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed76615ff3068c8617077d95f9560a69
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_351a68815b6ba095d6e26f7b860ce1b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8785b194a5d1ab60ebb9802a23713693
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f111a5a195b89ec3a096595089bc3396 |
| publicationDate |
2019-10-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I674617-B |
| titleOfInvention |
Method for performing a plasma processing process after a plasma cleaning process |
| abstract |
Embodiments of the present disclosure include a method for in-situ chamber cleaning efficiency enhancement process of a plasma processing chamber for a semiconductor substrate manufacturing process. In one embodiment, a method for performing a plasma processing process after cleaning a plasma process includes the steps of: performing the cleaning process in a plasma processing chamber in which there is no substrate disposed therein; subsequent supply includes at least hydrogen A plasma processing gas mixture of a gas and / or an oxygen-containing gas into the plasma processing chamber; applying RF source power to the processing chamber to form a plasma from the plasma processing gas mixture; and Interior surface. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I779395-B |
| priorityDate |
2016-05-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |