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publicationDate 2019-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I670783-B
titleOfInvention Method and system for improving process uniformity
abstract The semiconductor processing chamber may include a remote plasma region and a processing region fluidly coupled to the remote plasma region. The processing area may be configured to accommodate the substrate on the support base. The support base may contain the first material at the inner region of the base. The support base may also include an annular member coupled to the distal portion of the base or at an outer region of the base. The ring member may contain a second material different from the first material.
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