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publicationDate 2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I662864-B
titleOfInvention Plasma processing chamber, substrate support and method of manufacturing same
abstract By using a sleeve to cover the conductive surface inside the pores, the parasitic plasma in the pores in the components of the plasma processing chamber can be eliminated. The pores in the chamber member (eg, the upper electrode or the substrate support) may be air holes, ascending pin holes, helium channels, conduits, and / or aerations.
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