| abstract |
The present invention relates to a thermosetting vinyl organic tantalum resin composition comprising: any one of a linear vinyl organic tantalum resin, a cyclic vinyl organic tantalum resin, and a three-dimensional random network structure MQ vinyl organic tantalum resin. Or a combination of at least two vinyl organic oxime resins; a vinyl modified polyphenylene ether resin; and a free radical initiator. The present invention also provides a high frequency circuit substrate prepared using the resin composition as described above and an application thereof. The high-frequency circuit substrate of the invention has low dielectric constant, low dielectric loss, low water absorption, and the interlayer adhesion can meet the requirements of the adhesion between the layers of the copper-clad layer, and can realize the halogen-free and phosphorus-free V-0 flame retardant. |