| abstract |
The present invention discloses a resin composition comprising: a modified polyphenylene ether resin and an organic phosphonium compound containing an unsaturated double bond. The present invention also discloses a preparation method of preparing a high-frequency circuit substrate using the resin composition as described above and a high-frequency circuit substrate prepared by the method. The high-frequency circuit substrate of the invention has high glass transition temperature, high thermal decomposition temperature, high interlayer adhesion, low dielectric constant and low dielectric loss tangent, and is very suitable as a circuit substrate for high-frequency electronic equipment. |