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filingDate 2014-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_59a91e69d7defb6fa952090b676895fa
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publicationDate 2018-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I636717-B
titleOfInvention Two-step direct writing of laser metallization
abstract The invention discloses a method for manufacturing, which comprises coating a substrate (22) with a substrate (28), the substrate (28) comprising a material to be patterned on the substrate. A pattern (42) is fixed in the substrate by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the substrate without fully sintering the pattern. The substrate remaining on the substrate outside the fixed pattern is removed, and after removing the substrate, the material in the pattern is sintered.
priorityDate 2013-02-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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