http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I630655-B

Outgoing Links

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2016-08-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f67da1d1acda15c869b1c557111f9374
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1203c0b545ec3d1226ed03cf831636ab
publicationDate 2018-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I630655-B
titleOfInvention Dry etching method
abstract The present invention provides a dry etching method that maintains a mask selection while being plasma-etched into a vertical shape.nn n n The present invention is a dry etching method which is a dry etching method which maintains a mask selection while being plasma-etched into a vertical shape, and is characterized in that it has a first process which is to be etched by using a reactive gas. Etching, the etching shape of the film to be etched is a skirt shape, and the second process is to form the skirt shape into a vertical shape by sputtering etching after the first process.
priorityDate 2015-12-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 30.