| abstract |
The present invention provides a heat-conductive photosensitive resin comprising (a) a photosensitive polyimide, (b) an inorganic filler, and (c) a cerium oxide solution. The content of the photosensitive polyimide is 50-80% of the total weight of the solid content of the heat-conductive photosensitive resin. The inorganic filler is at least one selected from the group consisting of alumina, graphene, inorganic clay, mica powder, boron nitride, aluminum nitride, cerium oxide, zinc oxide, zirconium oxide, carbon nanotubes, and nano carbon fibers. The thermally conductive type photosensitive resin has a solid content of 20 to 50% by weight and a particle diameter of 40 to 5 μm. The cerium oxide solution contains cerium oxide particles which are sol-gel-formed, and the particle diameter of the particles is 10-15 nm, and the content is 5-30% of the total weight of the solid content of the heat-conductive photosensitive resin. The thermal conductivity type photosensitive resin has a thermal conductivity of 0.4-2. |