| abstract |
The present invention provides a resin having high elongation, low stress, high sensitivity, and high residual film ratio when used in a photosensitive resin composition.nA photosensitive resin composition containing a resin having a structure represented by the general formula (1) and/or (2), wherein the resin is characterized in that: (a) contains 10 to 80 mol% as a general formula (1) And (2) R1 having an alicyclic structure having 4 to 40 carbon atoms, (b) containing 10 to 80 mol% of R2 having the formula (1) and (2) having a carbon number of 20 An organic group of ~100 polyether structure.n□ (In the general formulae (1) and (2), R1 represents a tetravalent organic group having a monocyclic or condensed polycyclic alicyclic structure having 4 to 40 carbon atoms, and R2 is a carbon number of 20 to 100. a divalent organic group of a polyether structure, and R3 represents hydrogen or carbonnThe organic groups of 1 to 20, n1 and n2 each represent a range of 10 to 100,000, and p and q represent integers corresponding to 0≦p+q≦6. ) |