http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I618139-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32357
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
filingDate 2013-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8073fab7bc6a8a78b49e72b9a6f881fd
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_94879ef4d212a86d39c2a2c1e747f063
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publicationDate 2018-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I618139-B
titleOfInvention 矽-carbon-nitride selective etching
abstract A method of etching a patterned germanium-containing nitrogen-and-carbon material on a patterned heterostructure is described, the method comprising remote plasma etching formed from a fluorine-containing precursor and an oxygen-containing precursor. The plasma effluent from the remote plasma flows into the substrate processing zone where the plasma effluent reacts with the exposed areas containing the -矽-nitrogen-and-carbon material. The plasma effluent reacts with the patterned heterostructure to selectively remove the yttrium-nitrogen-and-carbon material from the exposed yttrium-nitrogen-and-carbon material region while removing the selected material very slowly Other exposed materials.
priorityDate 2012-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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