| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45536
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45534
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32779
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68764
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32449
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-507
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45551 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01J37-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-687 |
| filingDate |
2015-05-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21fcfbcd1ed8fa4fd394538f5a3cd79e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b13b15ae666bc4df8241b6a26b7c4a8d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c633fbac8e82f01a241d2d66facd674
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fc3d709e782b03b13cde96822da5827
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e4a2d06118bcebab55fa0b03a477e64 |
| publicationDate |
2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I616951-B |
| titleOfInvention |
Plasma processing method and plasma processing device |
| abstract |
A plasma processing method is to supply a processing gas to a predetermined plasma processing region, and plasma-treat the processing gas in a plasma generating region, and apply a plasma treatment to the film formed on the substrate. The in-plane treatment amount distribution of the film formed on the substrate by the plasma treatment was obtained. Then, based on the obtained in-plane processing amount distribution, the flow rate of the processing gas supplied to the region where the processing amount of the plasma processing is to be increased is relatively increased, or is supplied to the plasma to be reduced. The flow rate of the process gas is adjusted in such a manner that the flow rate of the process gas in the treated treatment zone is relatively reduced. Then, the processing gas of the adjusted flow rate is supplied to the predetermined plasma processing region to apply the plasma treatment to the film formed on the substrate. |
| priorityDate |
2014-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |