| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_480a969e45c19af12d153b8f01824636 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-30655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-68735
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-3211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67069
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate |
2014-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82bde71cbc8fe9e7730d67a4f45843cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_db91fab620609a08e94a3eb61f521d1b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_394f988f048e22e9061ce507452d30d8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f011dd196e4e194601e0d9ccc4985930
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_56eeae39bbd75e828e68d2ae3e4ab3f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ac55cae45c1fe247f714491295f692d |
| publicationDate |
2017-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-I587388-B |
| titleOfInvention |
Method and apparatus for plasma cutting semiconductor wafers |
| priorityDate |
2013-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |