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filingDate 2004-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_25b889114b1704e306d4f91543b9c677
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_42f4c8c3bae6105d2f666241c839bc3c
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publicationDate 2007-07-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I284370-B
titleOfInvention Use of hypofluorites, fluoroperoxides, and/or fluorotrioxides as oxidizing agent in fluorocarbon etch plasmas
abstract A mixture and a method comprising same for etching a dielectric material from a layered substrate are disclosed herein. Specifically, in one embodiment, there is provided a mixture for etching a dielectric material in a layered substrate comprising: a fluorocarbon gas, a fluorine-containing oxidizer gas selected from the group consisting of a hypofluorite, a fluoroperoxide, a fluorotrioxide, and combinations thereof; and optionally an inert diluent gas. The mixture of the present invention may be contacted with a layered substrate comprising a dielectric material under conditions sufficient to form active species that at least partially react with and remove at least a portion of the dielectric material.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I558655-B
priorityDate 2003-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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