http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I278055-B

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filingDate 2005-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2007-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eee14016755ed38cedb16939694a43e
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publicationDate 2007-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I278055-B
titleOfInvention Methods and apparatus for reducing arcing during plasma processing
abstract In a first aspect, a method is provided for use during plasma processing. The first method includes the steps of (1) placing a substrate on a substrate holder of a plasma chamber; (2) positioning a cover frame adjacent and below a perimeter of the substrate; and (3) employing the cover frame to reduce arcing during plasma processing within the plasma chamber. Numerous other aspects are provided.
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Total number of triples: 27.