http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I230415-B

Outgoing Links

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1cdd7f1bcb1ef27b40b999ab17671911
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
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filingDate 2003-03-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1ec333be6f392bb40c91c6dfb7c2fc7f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1714a923920481c7975cf28b5405791f
publicationDate 2005-04-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-I230415-B
titleOfInvention Electrode for dry etching a semiconductor wafer
abstract Disclosed is an electrode for dry etching a semiconductor wafer. The electrode includes a first electrode and a second electrode. The first electrode includes a first flat plate and a ring-shaped first protrusion corresponding to one surface of the edge of a wafer, and the second electrode includes a second flat plate and a ring-shaped second protrusion corresponding to the other surface of the edge of the wafer. The first flat plate and the second flat plate are the same dimension, and the first protrusion and the second protrusion are the same dimension.
priorityDate 2002-03-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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Total number of triples: 23.