http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-469494-B
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c16d2144a81bfa32a665dca1e93c3d37 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C30B31-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B31-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C30B25-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-56 |
| filingDate | 2000-12-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2001-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f587898abbab5fc42f156b5c90eb643e http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_60f951a1501a4ca9a271599a368f2a16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd4f635ddcd00dd0464aa8d0889f1680 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fd67a3803e4dc6d422438bb09545ae5b |
| publicationDate | 2001-12-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-469494-B |
| titleOfInvention | Apparatus having reflector for forming thin film |
| abstract | A thin film forming apparatus includes a wafer heating means having a wafer-loading region at an upper portion, a showerhead located at a position opposite to the wafer-loading region for ejecting a source gas toward the wafer surface when a wafer is loading, a reflecting member positioned between the showerhead and the heating member for reflecting thermal energy radiated from the heating member toward the wafer-loading region, and pumping member for controlling an air pressure in the chamber provided therein with the wafer heating member, the showerhead and the reflecting member for discharging by-products created in the chamber toward the outside, thereby preventing particles from being deposited on the wafer during the formation of the thin film. In addition, even without an additional power supply during the film forming process to the annealing process, the wafer temperature can be directly increased to a stabilized temperature pertinent to the annealing, and maintained as a uniform temperature distribution. Furthermore, temperature control is not needed until the stabilized temperature is reached, even if necessary, it needs only short time in temperature control, thereby increasing productivity semiconductor device. |
| priorityDate | 2000-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23940 http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419577462 |
Total number of triples: 25.