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filingDate 1997-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2001-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_408f1dc0e04ab4efb4d37325c937b69c
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publicationDate 2001-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-457576-B
titleOfInvention Method of forming a titanium film and a barrier metal film on a surface of a substrate through lamination
abstract A method of forming a titanium film and a titanium nitride film on a substrate by lamination which method is capable of suppressing contamination of the substrate due to the by-product and reducing a contact resistance value of the titanium film. By carrying out the step of forming a titanium film on a surface of a substrate (2), the step of subjecting the substrate to the plasma processing in an atmosphere of the mixed gas of nitrogen gas and hydrogen gas for nitriding a surface layer of the titanium film to form thereon a nitride layer, and the step of forming a barrier film (e.g., a titanium nitride film) on the titanium film having the nitride layer formed thereon, both the titanium film and the titanium nitride film are formed on the substrate by lamination.
priorityDate 1996-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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