Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_80787665b837ed3eb503bbcd27c0043a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-0335 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-485 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-315 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76855 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B12-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L28-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8242 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 |
filingDate |
1999-08-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a0ba3e4de4595567dd1db6a2ca7744f2 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a057394ed8ac90b1357be0f83b0a1a96 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7289d50b84c74e8150618fb4935a2436 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0a74a115e611318f600a03b587473f8 |
publicationDate |
2001-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
TW-451460-B |
titleOfInvention |
Semiconductor integrated circuit device and method for making the same |
abstract |
The cap insulating film on the gate electrode is formed into a laminated structure of a silicon oxide film and a silicon nitride film formed thereon. When forming the connection hole, an etching is carried out in a condition where the silicon oxide film is easier to be etched than the silicon nitride film. The etching is terminated when the silicon nitride film is exposed. Thereafter, an etching is carried out in a condition where the silicon nitride film is easier to be etched than the silicon oxide film, thereby forming the connection hole exposed from the semiconductor substrate 1. |
priorityDate |
1998-08-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |