http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-202125677-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_bce787970b69aeb08d159e7c101c9ed7
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32449
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32458
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02274
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32899
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01J37-32862
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
filingDate 2017-04-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c99dbb3dc2acf46009a6c0801af51a5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_84b3fde0e1eab19f30b0ece8488038e9
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_45ad460e52cb6b124debc574cbe012ab
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_36e4a5391e7596029db45c5a3a2368cc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38796c2465a29ae4b912c8e9434db1f5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cefe12ecebae7ad1def9d44bb26ecb59
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d22046f62d9c33b342bb57cef3559d83
publicationDate 2021-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-202125677-A
titleOfInvention Plasma enhanced anneal chamber for wafer outgassing
abstract Implementations described herein provide for thermal substrate processing apparatus including two thermal process chambers, each defining a process volume, and a substrate support disposed within each process volume. One or more remote plasma sources may be in fluid communication with the process volumes and the remote plasma sources may be configured to deliver a plasma to the process volumes. Various arrangements of remote plasma sources and chambers are described.
priorityDate 2016-04-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24553
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419523397

Total number of triples: 31.