| abstract |
The present invention is a metal foil with a carrier, its use method, and its manufacturing method. It is provided that both the exposure for the preliminary circuit and the exposure for the fine circuit at the time of wiring formation can be performed using the same alignment mark as a reference. The result is , It is possible to form a preliminary circuit and a metal foil with a carrier for a micro circuit at the same time in a one-step circuit formation process. This metal foil with a carrier is a metal foil with a carrier that is provided with a carrier, a release layer provided on at least one surface of the carrier, and a metal layer provided on the release layer, wherein the metal foil with a carrier has: There are a carrier, a peeling layer, and a metal layer for wiring, and at least one of the above-mentioned surfaces of the metal foil with a carrier is provided to form an alignment mark used for position alignment during wiring formation accompanied by exposure and development. At least 2 The location of each determines the use range. |