| abstract |
One or more embodiments described herein generally relate to methods for chucking and de-chucking a substrate to/from an electrostatic chuck used in a semiconductor processing system. Generally, in embodiments described herein, the methods apply the following sequence: (1) apply a first voltage from a direct current (DC) power source to an electrode disposed within a pedestal; (2) introduce process gases into a process chamber; (3) apply power from a radio frequency (RF) power source to a showerhead; (4) perform a deposition process on the substrate; (5) stop applying the RF power; (6) remove the process gases from the process chamber; and (7) stop applying the DC power. |