| abstract |
The invention provides an adhesive sheet, which is used for grinding of hard and brittle substrates in the back grinding step of hard and brittle substrates, and has excellent grinding precision, low pollution, productivity, and fixability.nThe adhesive sheet of the present invention is provided with an adhesive layer, and the adhesive layer includes an adhesive containing a base polymer and a foaming agent having a foaming temperature of 90°C or higher, and the adhesive surface of the adhesive sheet is bonded In the case of silicon wafers, the shear adhesion strength is 1.0 MPa or more at an ambient temperature of 25°C, and 0.2 MPa or more at an ambient temperature of 80°C. |