| abstract |
Representative embodiments of techniques and devices are used to reduce or prevent the diffusion of conductive materials into insulating or dielectric materials that are bonded to the substrate. Due to the overlap, the misaligned conductive structures may be in direct contact with the dielectric portions of these substrates, especially when using direct bonding technology. The barrier interface that can suppress the diffusion is usually disposed at the overlap between the conductive material and the dielectric. |