| abstract |
A semiconductor package includes a first semiconductor wafer, a plurality of first conductors, a first conductive pattern, a second semiconductor wafer, and a sealing body. The first conductive pattern is electrically connected to the first conductor. The second semiconductor wafer is disposed on the first semiconductor wafer. The sealing body is located on the first conductive pattern and laterally encapsulates the second semiconductor wafer. The first semiconductor wafer includes a first active surface, a sensing region, a first back surface, and a plurality of through holes. The sensing area is located on the first active surface. The through hole extends from the first back surface to the first active surface. The first conductive pattern is on the first back surface. The second semiconductor wafer includes a second active surface facing the first back surface. The second semiconductor wafer is electrically connected to the first semiconductor wafer and the first conductive pattern through the first conductor. A method for manufacturing a semiconductor package is also proposed. |